Auto Dry Film Lamination
CUON Solution Co., Ltd
This laminator is use to attach photo or solder resist dry film on wafer active side to make wafer pattern.
(Lamination method : Vacuum chamber lamination)
Specification
Application wafer : 6", 8" or 8", 12”
Application tape : Photo resist dry film
UPH : 60 wafer/hr (8"), 55 wafer/hr (12")
Main controller : PLC
Data & GUI : PC
Blade life time : 500 sheets
Wafer center accuracy : +/-0.5mm
Blade temp : 120℃ +/-5
Chuck temp : 100℃ +/-5
Tape consumption : 30~40mm
Wafer angle : 0′, 90’, 180’, 270’
Tape cutting angle adjustable: 70' ~ 90'
Tape thickness: 50um
Tape width: 230mm, 250mm for 8" / 330mm for 12"
Tape Tension Controller: Yes
- Bumped wafer (30㎛ ~250 ㎛)
- DBG process
- FOUP Cassette loader
- HEPA filter
- GEM interface