Semi Auto BG Tape Lamination
CUON Solution Co., Ltd
This lamination semi-automates the application of protection tape on the surface of the semiconductor wafer during back grinding.
Specification
Application wafer : 6", 8" or 8", 12”
Application tape : Non-UV & UV Tape
UPH : 55 wafer/hr (12"), 60 wafer/hr (8")
Main controller : PLC
Data & GUI : PC
Blade life time : 500 sheets
Wafer center accuracy : +/-0.5mm
Blade temp : 120℃ +/-5
Chuck temp : 80℃ +/-5
Tape consumption : 30~40mm
Wafer angle : 0′, 90’, 180’, 270’
Tape cutting angle adjustable: 70' ~ 90'
Tape Tension Controller: Yes
- Bumped wafer (30㎛
~250 ㎛)
- DBG process
- Heating bond roller
- HEPA filter
- GEM interface