Fully Automatic LC Tape Lamination
CUON Solution Co., Ltd
Fully auto LC tape lamination which laminates LC tape to wafer backside after Back Grinding.
Extra Features:
Chuck positioning by Vision System
Core type tape cutting
Protect tape auto detaping (removal tape)
Wafer cleaning function
Cooling chuck installed
Specification
Application wafer : 6", 8" or 8", 12”
Cutting size: 299.7mm, 199.7mm
Application tape : LC2850 (Adwill)
UPH : 30 wafer/hr (8"), 25 wafer/hr (12")
Main controller : PLC
Data & GUI : PC
Core life time : 60,000 sheets
Wafer center accuracy : +/-0.5mm
Bond roller temp : 80℃
Chuck temp : 100℃ +/-5
Tape thickness: 22um, 25um, 40um
Tape consumption : 30~40mm
Tape Tension Controller: Yes
- FOUP Cassette
- ID Reader
- DSC & Heat Cassette (Thin wafers)
- HEPA filter
- GEM interface
- 8" Flat-type wafers