Inline vision equipment for testing defects in lead frame chips and wires in ring frames loaded into cassettes.
2D Vision Inspection
- Rotation, movement, crack inspection after chip bonding
- Bending, breaking, short inspection after wire bonding
Compact Design
- 1684 (W) x 1800 (D) x 1764 (H) mm
- 25 megapixel camera
- 4.5μm telecentric lens
- 8 layers light (UV)
3D Vision Inspection (LV50SH)
- High speed-fixed density 3D laser sensor application