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  • LED AI Vision Inspection
Cressem
LED AI Vision Inspection
Cressem

LV30SH

Inline vision equipment for testing defects in lead frame chips and wires in ring frames loaded into cassettes.


2D Vision Inspection

  • Rotation, movement, crack inspection after chip bonding
  • Bending, breaking, short inspection after wire bonding

Compact Design

  • 1684 (W) x 1800 (D) x 1764 (H) mm
  • 25 megapixel camera
  • 4.5μm telecentric lens
  • 8 layers light (UV)

3D Vision Inspection (LV50SH)

  • High speed-fixed density 3D laser sensor application

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