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Packaging AI Vision Inspection
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Packaging AI Vision Inspection
PV11SS
PV11SS / PV30SS
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Description
PV11SS
Stand alone
vision equipment that tests a defect in chips and wires after chip mounting and wire bonding.
2D Vision Inspection
Rotation, movement, crack inspection after chip bonding
Bending, breaking, short inspection after wire bonding
Design Specifications
800 (W) x 1500 (D) x 1650 (H)
12 megapixel camera
4μm telecentric lens
7 layer coaxial colour light
PV30SS
In-line vision
equipment that tests a defect in chips and wires after chip mounting and wire bonding.
2D Vision Inspection
Rotation, movement, crack inspection after chip bonding
Bending, breaking, short inspection after wire bonding
Design Specifications
800 (W) x 1500 (D) x 1650 (H)
12 megapixel camera
4μm telecentric lens
7 layer coaxial colour light
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