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PV11SS
PV11SS / PV30SS

PV11SS

Stand alone vision equipment that tests a defect in chips and wires after chip mounting and wire bonding.


2D Vision Inspection
  • Rotation, movement, crack inspection after chip bonding
  • Bending, breaking, short inspection after wire bonding

Design Specifications
  • 800 (W) x 1500 (D) x 1650 (H)
  • 12 megapixel camera
  • 4μm telecentric lens
  • 7 layer coaxial colour light

PV30SS

In-line vision equipment that tests a defect in chips and wires after chip mounting and wire bonding.


2D Vision Inspection
  • Rotation, movement, crack inspection after chip bonding
  • Bending, breaking, short inspection after wire bonding


Design Specifications
  • 800 (W) x 1500 (D) x 1650 (H)
  • 12 megapixel camera
  • 4μm telecentric lens
  • 7 layer coaxial colour light


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