Fully Automatic Wafer Tape Lamination
CUON Solution Co., Ltd
Specification
| Application Wafer | 8'' & 12'' |
| Wafer Thickness | 600um (8") |
| 600um (12") | |
| Application Tape | Non UV and UV Tape |
| Main Controller | PLC |
| Data and GUI | PC |
| Blade Temperature | 120ºC +/- 5 |
| Blade Life Time | 500 Sheets |
| Wafer Center Accuracy | +/- 0.5 mm |
| Wafer Angle | 0,90,180,270 Deg |
| Chuck Temperature | 80ºC +/- 5ºC |
| Tape Cutting Angle Adjustable | 70º~90º |
| Tape Tension Controller | Yes |
| Tape Consumption | 30~40mm |
| Tape Width | 8 inch: 230~250um 12 inch: 333um |
| UPS | 8inch: 60 Wafer/Hour |
| 12inch: 55 Wafer/Hour Note: standard /Normal tape |
Options
|
Facility
| Power Supply | AC220V +/-10% |
| Phase | Single |
| Frequency | 50/60Hz |
| Amphere | 30A |
| Air Supply | 5.0Kgf/cm2 |
| Dimension for 12”, 8” machine | 2300x1600x1850(LxDxH) approx. 1800kg |