Wafer Macro / Micro inspection machine
CUON Solution Co., Ltd
This machine is designed to inspect wafer pattern or backside with wafer thickness or warpage Measurement.
Specification
Application carrier : 8" and 12”
Application cassette : FOUP, FOSB, DSC, Special cassette
Main system control : by PLC (Omron)
Data & GUI : by PC
Tower lamp : 4 colors(R, Y, G, B)
EMO : 2EA
Throughput : 80~100 wph/hr
Noise level : 80 dB