Epoxy Mold Compound dispensing machine
CUON Solution Co., Ltd
This machine is designed to dispense Epoxy Mold Compound to metal carrier uniformly for mold chase process.
Features:
Real-time monitoring of dispense quantity
Operation via manual
Load cell installation and weight scale
Specification
Application carrier : 8" & 12”
Dispense accuracy : +/- 5% from target weight
Throughput: 300mm panel at 70 grams per panel
Dispense rate: Programmable dispense rate from 2 gram to 500 gram minutes (Resolution: 0.5)
Hopper capacity: 10 litter (7kg)
Noise level : 80 dB
- Integrated with other equipment