Spin Cleaning System
CUON Solution Co., Ltd
CUSSC-080/CUSSC-120
Semi Spin cleaner to remove foreign materials on wafer surface after chip dicing process

-. Application ring frame : 8 inch & 12 inch
-. Conversion : Changeable without any tool
-. Wafer w/ring frame : Holding by vacuum
and latch
-. Hot air supply : Controlled up to Max. 60˚C
-. Hot air spray time : Adjusted by Timer
-. Hot air moving speed : Control by AC Motor.
-. Chuck spin speed : by AC Servo motor
Adjusted up to Max.3000RPM
-. Door locking check : by Switch
-. UPH : 50 lead frame/hr
-. Main controller : PLC (Omron)
-. Durable ball bearing & coupling
-. Noise level : Max. 80 Db
-. EMO : 2 ea
-. Tower lamp : 3 color(Red, Yellow, Green)
-. ESD : 1000v------> 100v, with 10 sec,
Ion balance : +/-5 volt