Description                                                     

Specification

Ring frame cassette                  

2 ports

Wafer capability 

6 inch & 8 inch

Application wafer 

Glass Wafer/Silicon Wafer

Application tape

Normal or UV tape

Ring frame capability

8 inch

Wafer thickness  

100 um~

Wafer warpage

4 mm~

ESD 

1000V~100V, 10secs, Ion balance : +/-50V

Operation                                                        

15” touch monitor, Data & GUI by PC

Main system control

PLC (Omron)

EMO switch

4ea

Noise level

Max. 80dB

UPH

50 frame/hr

Grip ring buffer

Up to 40 ea

Label size

10㎜ x 50㎜

Label attach position

0°, 90°, 180° and 270°

Label attach position accuracy

±1.0㎜

Tape remained length after cutting

0.5 mm ~ 1 mm