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Semi Auto BG Tape Lamination
CUON Solution Co., Ltd

-. Application wafer : 6”,8” or 8”, 12”

-. Application tape: normal & UV tape

-. UPH : 55 wafer/hr(12”)  60 wafer/hr(8”)

-. Main controller : PLC

-. Data & GUI : PC

-. Blade life time : 500 sheets

-. Wafer center accuracy : +/-0.5mm

-. Blade temp : 120℃ +/-5

-. Chuck temp : 80℃ +/-5

-. Tape consumption: 30~40mm

-. Wafer angle : 0′, 90’, 180’, 270’

-. Tape tension controller

-. Tape cutting angle adjustable : 70’~90’

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