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Fully Auto LC Tape Lamination
CUON Solution Co., Ltd

-. Application wafer : 6”,8” or 8”, 12”

-. Cutting size : 299.7mm,   199.7mm

-. Application tape: LC2850 (Adwill)

-. Tape thickness : 22um,25um, 40um

-. UPH : 30 wafer/hr(8”),  25wafer/hr(12”) 

-. Main controller: PLC

-. Data & GUI: PC

-. Core lifetime : 60,000 sheets

-. Chuck temp : 100℃ +/-5

-. Bond roller temp : 80℃

-. Chuck positioning by vision system

-. Core type tape cutting

-. Protect tape auto detaping(removal tape)

-. Wafer cleaning function

-. Cooling chuck installed

-. Wafer center accuracy : +/-0.5mm

-. Tape consumption: 30~40mm

-. Tape tension controller

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