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  • Fully Automatic Wafer Tape Lamination
Fully Automatic Wafer Tape Lamination
CUON Solution Co., Ltd


Application Wafer 8'' & 12''
Wafer Thickness 600um (8")
600um (12")
Application Tape Non UV and UV Tape
Main Controller PLC
Data and GUI PC
Blade Temperature 120ºC +/- 5
Blade Life Time 500 Sheets
Wafer Center Accuracy +/- 0.5 mm
Wafer Angle 0,90,180,270 Deg
Chuck Temperature 80ºC +/- 5ºC
Tape Cutting Angle Adjustable 70º~90º
Tape Tension Controller Yes
Tape Consumption 30~40mm
Tape Width 8 inch: 230~250um
12 inch: 333um
UPS 8inch: 60 Wafer/Hour
  12inch: 55 Wafer/Hour
Note: standard /Normal tape


  • FOUP cassette loader.
  • Bond Roller Heat
  • DBG Process Optional
  • Coin jar box loader.
  • Barcode system.
  • Wafer ID reader.
  • Hepa filter.
  • SECS/GEM interface.
  • Static eliminator.


Power Supply AC220V +/-10%
Phase Single
Frequency 50/60Hz
Amphere 30A
Air Supply 5.0Kgf/cm2
Dimension for 12”, 8” machine   2300x1600x1850(LxDxH) approx. 1800kg


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