GAM70 Laser Vision Measurement
Genitec Technology

Features:
- Ideal inspection for solder paste thickness, dealing with the increasingly growth of fine pitch, enhanced printing technology and high precision requirement
- Prevent virous kinds of defect from printing process, such as the bridging, deviation location, etc...
- Laser vision measurement, without contact and damage
- Statistical charts and process capability index be provided as the real-time data for quality control
- Easy to operate, fast gather the printing data for reference
- Measure printed solder thickness, height, length and interval
- Providing various kind of statistical charts, such as the distributive thickness chart, -R control chart and process capability index: Cp, Cpm ,Cpk for reference
- Analyze thickness for solder cross-section
- Inspect length and thickness for other kinds of materials
Printing For Control Chart:
- X-R control chart
- Cp, Cpk, Cpm capability index
- [Operation And Measurement]
- Display image full of screen
- Easy to sample
- Easy to operate
- Real-time appearing the statistic
- [Distributive Thickness Chart]
- Display and print the distributive thickneess chart
- Disply and print all the statistic
- Analysis the percentage for distributive thickness
Application:
- Get the results of statistics and analysis about all surveyed values in every thickness degree
- inspect the quality of solder printing process
- Survey the thickness benignancy of tin solder
- Measure the dimension of tin solder
- Provide thickness and dimension measurement function for other object