| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-EL190T
|
GEPL-190T
|
0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 1.00, 1.20, 1.60mm | 0.03, 0.04, 0.05, 0.06, 0.08, 0.10, 0.15, 0.20mm |
Features
CCL-EL190T / GEPL-190T has a higher Tg, lower CTE properties compared to CCL-EL 190 / GEPL-190. It is available for lead free reflow process, and especially excels in through hole connection reliability for high count multilayer motherboards. And, microvias can be easily made in the prepreg layers by CO2 laser drilling.
Typical applications
High count multilayer motherboards for internet routers, servers and IC tester devices.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-EL190T
type M |
GEPL-190T
type M |
0.06,0.08,0.09,0.10,0.13,0.15,0.20 0.25,0.30,0.40,0.50mm |
0.03,0.04,0.06,0.08,0.10, 0.15mm |
Features
Suitable for High Count Multilayer PWB due to Low Expansion,Low Loss. High Tg, Excellent Suitable for Lead Free Reflow
Typical applications
High count multilayer motherboards for internet routers, servers and IC tester devices.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-EL230T
|
GEPL-230T
|
0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50mm | 0.04, 0.06, 0.10, 0.15mm |
Features
CCL-EL230T / GEPL-230T excels in through hole connection reliability because of its high Tg and low CTE properties. And also, it is very suitable for high frequency circuits because of its low dielectric properties. It excels in filling to BVH and IVH because of good resin flow properties. In addition, microvias can be easily made in the prepreg layers by CO2 laser drilling, and it is available for lead free reflow process.
Typical applications
High count multilayer motherboards for internet routers, servers, base stations, switching systems and IC tester devices.
| Item | Condition | Unit | EL190T | EL190T type M |
EL230T | |
|---|---|---|---|---|---|---|
|
Dielectric Constant
|
1MHz
|
A
|
—
|
4.7
|
4.1
|
4.0
|
|
1GHz
|
A
|
—
|
4.3
|
3.9
|
3.8
|
|
|
10GHz
|
A
|
—
|
4.1
|
3.7
|
3.6
|
|
|
Dissipation Factor
|
1MHz
|
A
|
—
|
0.010
|
0.007
|
0.004
|
|
1GHz
|
A
|
—
|
0.011
|
0.008
|
0.005
|
|
|
10GHz
|
A
|
—
|
0.012
|
0.009
|
0.007
|
|
|
Insulation Resistance
|
C-96/20/65
|
Ω
|
5x1013-15
|
5×1013-15
|
5x1013-15
|
|
|
Surface Resistance
|
C-96/20/65
|
Ω
|
5x1014-16
|
5×1014-16
|
5x1014-16
|
|
|
Volume Resistivity
|
C-96/20/65
|
Ω·cm
|
5x1012-14
|
5×1012-14
|
5x1012-14
|
|
|
Flexural Strength
|
Warp
|
A
|
MPa
|
580
|
480
|
470
|
|
Fill
|
A
|
MPa
|
530
|
470
|
460
|
|
|
Flexural Modulus
|
Warp
|
A
|
GPa
|
27
|
23
|
22
|
|
Fill
|
A
|
GPa
|
27
|
23
|
22
|
|
|
Tensile Strength
|
Warp
|
A
|
MPa
|
330
|
310
|
300
|
|
Fill
|
A
|
MPa
|
330
|
260
|
250
|
|
|
Young's Modulus
|
Warp
|
A
|
GPa
|
27
|
23
|
22
|
|
Fill
|
A
|
GPa
|
26
|
23
|
22
|
|
|
Poisson's Ratio
|
Warp
|
A
|
—
|
0.17
|
0.16
|
0.16
|
|
Fill
|
A
|
—
|
0.16
|
0.15
|
0.15
|
|
|
Glass Transition Temp.
|
DMA
|
A
|
℃
|
240
|
240
|
210
|
|
TMA
|
A
|
℃
|
220
|
220
|
175
|
|
|
DSC
|
A
|
℃
|
215
|
215
|
175
|
|
|
Cofficent of Thermal Expansion
|
Warp, Fill
|
A
|
ppm/℃
|
14
|
15
|
15
|
|
Z
(α1, α2) |
A
|
ppm/℃
|
40/180
|
45/200
|
45/240
|
|
|
Thermal Conductivity
|
Laser Pulse Heating Method
|
A
|
W/m·K
|
0.45
|
0.44
|
0.44
|
|
Specific Heat
|
DSC
|
A
|
J/Kg·K
|
950
|
950
|
950
|
|
Decomposition Temp.
|
TG-DTA
|
A
|
℃
|
345
|
345
|
335
|
|
Time to Delamination
|
T-260
|
E-2/105
|
minutes
|
＞60
|
>60
|
＞60
|
|
T-288
|
E-2/105
|
minutes
|
20
|
20
|
12
|
|
|
T-300
|
E-2/105
|
minutes
|
7
|
7
|
3
|
|
|
Peel Strength
|
12μ
|
A
|
KN/m
|
0.9
|
0.9
|
0.9
|
|
18μ
|
A
|
KN/m
|
1.2
|
1.2
|
1.2
|
|
|
18μ-VLP
|
A
|
KN/m
|
1.1
|
1.1
|
1.1
|
|
|
Specific Gravity of Resin
|
A
|
—
|
1.44
|
1.44
|
1.42
|
|
|
Flame Resistance
|
UL94
|
E-168/70
|
—
|
V-0
|
V0
|
V-0
|