This tape is designed for surface protection of semiconductor wafers during the backgrinding process. Our backgrinding tape development has advanced to meet the needs of changing semiconductor packaging trends, such as reduced wafer thickness, increased WLCSP bump height and newly developed processes.

Features

• Reduced wafer breakage during the backgrinding process by using shock absorbing properties of our tape.
• Developed for eas de-taping from thinned wafer without stress
• Lower impurities allows for higher levels of wafer cleanness

Lineup

• Standard type
• For thinned wafer
• For DDF process