Polyimide tapes
Hibex Singapore
Available types:
Double-sided thermal release adhesive type
Single-sided thermal release adhesive type
Customizable with ESD resistance
Features
- Heat resistant up to 290°C * 5 minutes
- No residue & stains
- Easy removal and no damage to the substrate surface
- Good thermal stability
- Customizable with Anti-static resistant
- Die-cut converting process friendly
Application
- Leadframe masking, PCB masking, PCB reflow, Package protection, Sputtering, Wave soldering, Solder reflow, Advanced substrate masking. Other high temperature processes.