UV-Tapes for Wafer Backgrinding and Etching
Hibex Singapore
Available types of tapes:
Heat-resistant
Thermal-release
Chemical-resistant
Bumped wafers
A new innovative adhesive tape for wafer backgrinding and etching.
Features
- High adhesion prevents wafer breakage caused by delamination of tape due to lack of tackiness.
- Hardness of backing film and adhesive is controlled to optimize shock and vibration absorption.
- Strong resistance to acid etchants makes it possible to eliminate resist-process.
- Characteristics of near zero adhesion after UV irradiation eliminate possibility of residues and wafer breakage.
- Consisting of strictly selected raw materials, contains little impurities and provides virtually no contamination.