Non-UV/ UV Tapes for Wafer dicing
Hibex Singapore
High tracking performance, low contamination on difficult-to-adhere workpieces.
Various thicknesses, adhesive strengths and base materials to meet your needs.
Additional types:
Stealth dicing process
Package
Anti-static grade
A dicing tape is used for fixing a work piece during the
dicing process in the manufacturing of semiconductors, electronic and optical
components. With greater diversity and higher quality in chips, dicing tapes
also require advanced technology. These dicing tape is used widely in a variety
of applications including silicon and GaAs semiconductors (compound
semiconductors), encapsulated package substrates, ceramics, glass, and crystals.
Features
- Excellent control to back-side chipping and chip fly-off
- Excellent over-time stability
- Excellent adhesiveness (shape-following properties)
- High performance to EMCs (Epoxy Mold Compounds) and other types of difficult-to-adhere workpieces
- Excellent expandability and smooth peeling
Application
- Silicon (SI), Gallium Arsenide (GaAS) and other type of Semiconductors (Wafers)
- Package substrate (BGA/QFN etc) (Package)
- Glass, crystal