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BT Materials for High Speed IC Plastic Package
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BT Materials for High Speed IC Plastic Package

These materials excel in dielectic properties and they are suitable for IC plastic package such as high frequency devices.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-HL832MG GHPL-830MG 0.06, 0.1, 0.13 0.15, 0.18, 0.2, 0.25, 0.3, 0.35, 0.38, 0.4, 0.45, 0.5, 0.55, 0.6-0.8 (0.1step)mm 0.04, 0.045, 0.05, 0.055, 0.065, 0.075, 0.09, 0.1, 0.17mm

Features

CCL-HL832MG / GHPL-830MG has low dielectric properties. It was developed to meet the needs of RF semiconductor subtrates.

Typical applications

Substrates for RF modules, power amplifier modules, bluethooth modules.
 

Typical properties of Materials

 
Item Condition Unit HL832MG
Dielectric Constant
1MHz
A
4.2
1GHz
A
4.0
Dissipation Factor
1MHz
A
0.006
1GHz
A
0.008
Insulation Resistance
 
C-96/20/65
Ω
5x1013-15
Surface Resistance
 
C-96/20/65
Ω
5x1014-16
Volume Resistivity
 
C-96/20/65
Ω·cm
5x1012-14
Flexural Strength
Warp
A
MPa
540
Fill
A
MPa
500
Flexural Modulus
Warp
A
GPa
23
Fill
A
GPa
22
Tensile Strength
Warp
A
MPa
350
Fill
A
MPa
300
Young's Modulus
Warp
A
GPa
26
Fill
A
GPa
24
Glass Transition Temp.
DMA
A
210
TMA
A
180
Cofficent of Thermal Expansion
Warp, Fill
A
ppm/℃
15
Z
(α1, α2)
A
ppm/℃
55/220
Peel Strength
12μ
A
KN/m
0.9
18μ
A
KN/m
1.0
Flame Resistance
UL94
E-168/70
V-0

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