BT Materials for High Speed IC Plastic Package
MGC
BT Materials for High Speed IC Plastic Package
These materials excel in dielectic properties and they are suitable for IC plastic package such as high frequency devices.
Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
---|---|---|---|
CCL-HL832MG | GHPL-830MG | 0.06, 0.1, 0.13 0.15, 0.18, 0.2, 0.25, 0.3, 0.35, 0.38, 0.4, 0.45, 0.5, 0.55, 0.6-0.8 (0.1step)mm | 0.04, 0.045, 0.05, 0.055, 0.065, 0.075, 0.09, 0.1, 0.17mm |
Features
CCL-HL832MG / GHPL-830MG has low dielectric properties. It was developed to meet the needs of RF semiconductor subtrates.
Typical applications
Substrates for RF modules, power amplifier modules, bluethooth modules.
Item | Condition | Unit | HL832MG | |
---|---|---|---|---|
Dielectric Constant
|
1MHz
|
A
|
—
|
4.2
|
1GHz
|
A
|
—
|
4.0
|
|
Dissipation Factor
|
1MHz
|
A
|
—
|
0.006
|
1GHz
|
A
|
—
|
0.008
|
|
Insulation Resistance
|
C-96/20/65
|
Ω
|
5x1013-15
|
|
Surface Resistance
|
C-96/20/65
|
Ω
|
5x1014-16
|
|
Volume Resistivity
|
C-96/20/65
|
Ω·cm
|
5x1012-14
|
|
Flexural Strength
|
Warp
|
A
|
MPa
|
540
|
Fill
|
A
|
MPa
|
500
|
|
Flexural Modulus
|
Warp
|
A
|
GPa
|
23
|
Fill
|
A
|
GPa
|
22
|
|
Tensile Strength
|
Warp
|
A
|
MPa
|
350
|
Fill
|
A
|
MPa
|
300
|
|
Young's Modulus
|
Warp
|
A
|
GPa
|
26
|
Fill
|
A
|
GPa
|
24
|
|
Glass Transition Temp.
|
DMA
|
A
|
℃
|
210
|
TMA
|
A
|
℃
|
180
|
|
Cofficent of Thermal Expansion
|
Warp, Fill
|
A
|
ppm/℃
|
15
|
Z
(α1, α2) |
A
|
ppm/℃
|
55/220
|
|
Peel Strength
|
12μ
|
A
|
KN/m
|
0.9
|
18μ
|
A
|
KN/m
|
1.0
|
|
Flame Resistance
|
UL94
|
E-168/70
|
—
|
V-0
|