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Semiconductor Equipment
Cuon Solutions
Tape Lamination Equipments
Semiconductor Equipment
Tape Lamination Equipments
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Suction Cup Types for Automatic Screw Tightening
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Angle attachment (HIOS Shank)
Ball Point L Type Hexagon Wrench (Long type/9-pcs Set)
Carbon brush（for brush screwdriver)
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Hand support ring (for VZ series)
HIOS Spike Bit (only for Cross recess #0)
Pistol Attachment
Push start grip attachment
Screwdriver Cord
Shockless stand（for VZ series)
Torque adjustment nut protective cover (for VZ series)
Vacuum pump (for suction screwdriver)
Vertical Screwdriver Operating Stand
Meltio 3D printer
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Yaesu Keikogyo
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DEN-ON INSTRUMENTS
Genitec Technology
NetDry
Sawa Corporation
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Cuon Solutions
Tape Lamination Equipments
Tape Mounting Equipment
Tape Removing Equipment (Detaper)
Other Equipments
Technovision Inc.
Wafer Mounters
FM-224 Series (Manual)
FM-334 Series (Semi-Auto) : Small table-top
FM-664 Series (Semi-auto) : Both pre-cut tape and normal tape support
FM-903 Series (Semi-auto): Dedicated to normal tapes
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IWATSU
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Handler (automatic transfer device)
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L Load Testers
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HYBOND
Die Bonders
Peg and Beam Lead Diode Bonders
Wire Bonders
Tape Lamination Equipments
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Fully Automatic Wafer Tape Lamination
CUON Solution Co., Ltd
SGD 0
Queen Size
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