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Semiconductor Equipment
HYBOND
Peg and Beam Lead Diode Bonders
Semiconductor Equipment
Peg and Beam Lead Diode Bonders
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Push start grip attachment
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Technovision Inc.
Wafer Mounters
FM-224 Series (Manual)
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FM-664 Series (Semi-auto) : Both pre-cut tape and normal tape support
FM-903 Series (Semi-auto): Dedicated to normal tapes
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HYBOND
Die Bonders
Peg and Beam Lead Diode Bonders
Wire Bonders
Peg and Beam Lead Diode Bonders
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Price (High > Low)
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Model (Z - A)
Model 616B-001 Digital Ultrasonic Peg Bonder
HYBOND, Inc.
SGD 0
ENQUIRY NOW
Model 616B-003 Digital Ultrasonic Peg Bonder
HYBOND, Inc.
SGD 0
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Model 616B-005 Thermosonic Peg Bonder
HYBOND, Inc.
SGD 0
ENQUIRY NOW
