Carrier de-bonder system
CUON Solution Co., Ltd
This system is used to separate Metal carrier and Molded wafer after molding process.
Specification
Application mold size : 300/600 mm
Application warpage : Less than 6 mm
Warpage reduction: Less than 1~2 mm
UPH: 50 wafer/hr
Heating: 30 seconds
Cooling: 20 seconds
Main system control : by PLC (Omron)
Data & GUI : by PC
Operation: 10" touch monitor
EMO : 4 ea
ESD: 1000V => 100V (within 5 seconds)
Ion balance: +/- 50V
- Warpage measuring function
- Integrated with other equipment