Manual Tape Mounter
CUON Solution Co., Ltd
Manual wafer mounter that mounts wafer onto dicing tape once the operator supplies.
The wafer and ring frame by hand.
Specification
Application ring framer : 6", 8" or 8", 12”
Application tape: Non-UV/ UV tape
Wafer thickness: 200um (8") / 330 um (12")
Wafer warpage: 4mm >=
Tape wide: 300mm, 400mm
UPH : 40 ~ 50 wafer/hr (8"/ 12")
Main controller : PLC
Data & GUI : PC
Blade life time : 10,000 sheets
Bonding magazine : 6ea
PCB center accuracy: +/- 0.5mm
Chuck temp : 80℃ +/-5
Wafer angle: 0', 90', 180', 270'
- Non-contact type chuck
- Pre-cut tape function (290mm, 390mm)
- PCB used