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  • Fully Auto Ring Frame Remover
Fully Auto Ring Frame Remover
CUON Solution Co., Ltd

This wafer remover system automates the removal of the protection tape after mounted wafer.

Extra features:

Peel bar angle adjustable

Chuck surface cleaning function

Removal Tape

Porous remove chuck

Specification

Application wafer : 6", 8" or 8", 12”

Application tape : Non-UV & UV Tape

UPH : 45 wafer/hr (8"),  40 wafer/hr (12") [Based on remove speed 50 mm/s UV time 5 sec]

Main controller : PLC

Data & GUI : PC

Blade life time : 500 sheets

Wafer center accuracy : +/-0.5mm

Chuck temp : 60 +/-5

Tape Tension Controller: Yes

UV Irradiation specification: 

  1. 365 nm wave
  2. High pressure mercury lamp
  3. 100~1000 mj/ dosage
  4. Lamp life time 1000 hr
  5. Ring blower    
  6. UV sensor


Options (Add-Ons)

  • HEPA filter
  • GEM interface

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