Semi Auto Wafer Mounter
CUON Solution Co., Ltd
Semi-auto wafer mounter that mounts wafer onto dicing tape once the operator supplies The wafer and ring frame by hand.
Specification
Application wafer : 6", 8" or 8", 12”
Application tape: Non-UV & UV tape
Wafer thickness: 200 um (8") / 330 um (12")
Wafer warpage: 4mm >=
Tape wide: 300mm, 400mm
UPH : 40 ~ 50 wafer/hr (8", 12")
Main controller : PLC
Data & GUI : PC
Blade life time : 10,000 sheets
Chuck temp : 80℃ +/-5
Tape consumption : 30~40mm
Wafer angle : 0′, 90’, 180’, 270’
- Non-contact type chuck
- Pre-cut tape function (290mm, 390mm)
- HEPA filter
- GEM interface