Fully Auto Ring Frame Remover
CUON Solution Co., Ltd
This wafer remover system automates the removal of the protection tape after mounted wafer.
Extra features:
Peel bar angle adjustable
Chuck surface cleaning function
Removal Tape
Porous remove chuck

Specification
Application wafer : 6", 8" or 8", 12”
Application tape : Non-UV & UV Tape
UPH : 45 wafer/hr (8"), 40 wafer/hr (12") [Based on remove speed 50 mm/s UV time 5 sec]
Main controller : PLC
Data & GUI : PC
Blade life time : 500 sheets
Wafer center accuracy : +/-0.5mm
Chuck temp : 60℃ +/-5
Tape Tension Controller: Yes
UV Irradiation specification:
- 365 nm wave
- High pressure mercury lamp
- 100~1000 mj/㎠ dosage
- Lamp life time 1000 hr
- Ring blower
- UV sensor
- HEPA filter
- GEM interface