These materials were developed for the IC package industry, with an emphasis on excellent pressure cooker resistance and CAF resistance, to address the issues of package assembly, such as wire bondability and MRT level. These materials are widely used in the IC package industry due to their superior insulation resistance in high density designs. These materials are best suited to meet the demands of an industry in which the design direction is toward increasing miniaturization and density.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL832
CCL-HL830 |
GHPL-830
|
0.1-0.3(0.05step), 0.4, 0.45, 0.5-0.8(0.1step), 0.13(HL832 only)mm | 0.06, 0.1mm |
Features
CCL-HL832, HL830 / GHPL-830 have been standard materials for IC plastic packages such as BGAs.
Typical applications
Substrates for PGA, BGA.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL832EX
|
GHPL-830EX
|
0.1-0.5(0.05step), 0.6-0.8(0.1step), 0.13mm |
0.06, 0.1mm |
Features
CCL-HL832EX / GHPL-830EX is a new standard material and it is suitable for lead free reflow process. In containing the inorganic filler into resin system as the heat resistance, CCL-HL832EX / GHPL-830EX also improves the CTE properties and the stiffness compared to CCL-HL832,HL830 / GHPL-830.
Typical applications
Substrates for PGA,BGA.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL832HS
CCL-HL830HS Type LT |
GHPL-830HS
|
0.2-0.6(0.1step), 0.8mm | 0.03, 0.035, 0.04, 0.045, 0.05, 0.06, 0.07, 0.1mm |
Features
CCL-HL832HSType LT and CCL-HL830HS Type LT are high stiffness materials. And, greatly facilitating through hole formation by mechanical drilling or CO2 laser drilling.
Typical applications
Substrates for FC-PKG.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL832HS
Type HS |
GHPL-830HS
|
0.05, 0.06, 0.07, 0.1, 0.15, 0.2mm | 0.03, 0.035, 0.04, 0.045, 0.05, 0.06, 0.07, 0.1mm |
Features
CCL-HL832HS Type HS is a thin material and it has a high stiffness. It is suitable for lead free reflow process. And using the GHPL-830HS prepreg, insulation layers of 30 microns or more can be made, greatly facilitating microvia formation by CO2 laser drilling.
Typical applications
Substrates for CSP and memory cards.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL832TF
|
GHPL-830TF
|
0.05, 0.06, 0.1, 0.15, 0.2mm | 0.03, 0.035, 0.04, 0.045, 0.05, 0.06, 0.07, 0.1mm |
Features
CCL-HL832TF is also a thin material. It was developed to improve the micro-crack resistance in thermal cycle testing by increasing the toughness and flexibility of its resin system. It is suitable for lead free reflow process. And using the GHPL-830TF prepreg, insulation layers of 30 microns or more can be made, greatly facilitating microvia formation by CO2 laser drilling.
Typical applications
The same as for CCL-HL832HS Type HS / GHPL-830HS, but where micro-cracking is more of an issue.
| Item | Condition | Unit | HL832 | HL832EX | HL832HS | HL832TF | |
|---|---|---|---|---|---|---|---|
|
Dielectric Constant
|
|
1MHz
|
－
|
4.6
|
5.0
|
5.1
|
4.7
|
|
|
1GHz
|
－
|
4.3
|
4.6
|
4.7
|
4.5
|
|
|
|
5GHz
|
－
|
4.2
|
4.5
|
4.6
|
4.4
|
|
|
|
10GHz
|
|
4.2
|
4.4
|
4.5
|
4.3
|
|
|
|
20GHz
|
－
|
4.2
|
4.4
|
4.5
|
4.3
|
|
|
Dissipation Factor
|
|
1MHz
|
－
|
0.007
|
0.007
|
0.006
|
0.007
|
|
|
1GHz
|
－
|
0.016
|
0.010
|
0.014
|
0.011
|
|
|
|
5GHz
|
－
|
0.017
|
0.011
|
0.013
|
0.012
|
|
|
|
10GHz
|
－
|
0.017
|
0.012
|
0.015
|
0.013
|
|
|
|
20GHz
|
－
|
0.017
|
0.012
|
0.015
|
0.013
|
|
|
Insulation Resisstance
|
|
C-96/20/65
|
Ω
|
1015-16
|
1015-16
|
1015-16
|
1015-16
|
|
Surface Resisstance
|
|
C-96/20/65
|
Ω
|
1015-16
|
1015-16
|
1015-16
|
1015-16
|
|
Volume Resistivity
|
|
C-96/20/65
|
Ω・cm
|
1016-17
|
1016-17
|
1016-17
|
1015-16
|
|
Flexural Strength
|
|
|
Mpa
|
550
|
530
|
470
|
450
|
|
Flexural Modulus
|
|
|
Gpa
|
24
|
28
|
28
|
25
|
|
Tensile Strength
|
|
|
Mpa
|
320
|
300
|
290
|
280
|
|
Young's Modulus
|
|
|
Gpa
|
24
|
28
|
28
|
25
|
|
Glass Transition Temp.
|
DMA
|
|
℃
|
210
|
215
|
215
|
215
|
|
TMA
|
|
℃
|
180
|
185
|
185
|
185
|
|
|
DSC
|
|
℃
|
170
|
175
|
175
|
175
|
|
|
Cofficent of Thermal Expansion
|
X,Y
|
α1
|
ppm/℃
|
15
|
14
|
14
|
15
|
|
|
α2
|
ppm/℃
|
5
|
5
|
5
|
6
|
|
|
Z
|
α1
|
ppm/℃
|
55
|
35
|
35
|
40
|
|
|
|
α2
|
ppm/℃
|
220
|
150
|
140
|
160
|
|
|
Peel Strength
|
|
12μm
|
kN/m
|
1.0
|
1.0
|
0.90
|
0.90
|
|
|
18μ m
|
kN/m
|
1.2
|
1.2
|
1.1
|
1.1
|
|
|
Flame Resistance
|
|
E-168/70
|
—
|
V-0
|
V-0
|
V-0
|
V-0
|
|
Density
|
|
|
g/㎝3
|
1.8
|
2.0
|
2.0
|
1.9
|
|
Heat capacity
|
|
|
J/g・K
|
0.90
|
0.95
|
0.90
|
1.0
|
|
Thermal Conductivity
|
|
|
W/m・K
|
0.30
|
0.55
|
0.50
|
0.50
|
|
Poisson's ratio
|
|
|
—
|
0.18
|
0.18
|
0.19
|
0.18
|
|
Moisture absorption
|
|
85℃/85RH% 168h
|
%
|
0.42
|
0.36
|
0.34
|
0.37
|