These are the de facto standard materials for Chip-LED use. They excel in high reflectivity of visible light. And, they are very suitable for wire-bonding because of its stable mechanical properties at elevated temperatures and high heat resistance for longer term. In addition, they are halogen free materials.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL820
|
—
|
0.06, 0.1-1.0 (0.1step), 0.46mm |
—
|
Features
CCL-HL820 is an ivory colored material. It has high reflectivity of visible light and infrared.
Typical applications
Chip-LED, PWBs for IC cards and luminescent element devices.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL820W
|
—
|
0.06, 0.1, 0.15, 0.2-1.0(0.1step), 0.46mm |
—
|
Features
CCL-HL820W is a white colored material. The reflectivity of low wavelength (blue) light has been improved considerably compared with CCL-HL820, for blue and white LED.
Typical applications
Chip-LED.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL820WDB
|
—
|
0.06, 0.1-1.0 (0.1step),0.46mm |
—
|
Features
CCL-HL802WDB is another white colored material. In addition, the issue of yellowing caused by heating has been significantly improved in this material.
Also, the stiffness has been improved to make it effective in thin applications.
Typical applications
Chip-LED.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
|
CCL-HL820WDI
|
—
|
0.05,0.06,0.1-1.0(0.1step),0.46 |
—
|
Features
White material with high reflectance of visible light, much suitable for chip LED substrate.Less discoloration after heat treatment and light irradiation.
Typical applications
Chip-LED.
| Item | Condition | Unit | HL820 | HL820W | HL820WDB | HL820WDI | |
|---|---|---|---|---|---|---|---|
|
Dielectric Constant
|
1MHz
|
A
|
—
|
—
|
—
|
—
|
—
|
|
1GHz
|
A
|
－
|
5.0
|
4.9
|
5.7
|
5.7
|
|
|
Dissipation Factor
|
1MHz
|
A
|
—
|
—
|
—
|
—
|
—
|
|
1GHz
|
A
|
－
|
0.013
|
0.011
|
0.020
|
0.020
|
|
|
Insulation Resistance
|
C-96/20/65
|
Ω
|
5x1013-15
|
5x1013-15
|
5x1013-15
|
5x1013-15
|
|
|
Surface Resistance
|
C-96/20/65
|
Ω
|
5x1013-15
|
5x1013-15
|
5x1013-15
|
5x1013-15
|
|
|
Volume Resistivity
|
C-96/20/65
|
Ω·cm
|
5x1014-16
|
5x1014-16
|
5x1014-16
|
5x1014-16
|
|
|
Flexural Strength
|
Warp
|
A
|
MPa
|
500
|
490
|
480
|
480
|
|
Fill
|
A
|
MPa
|
490
|
480
|
470
|
470
|
|
|
Flexural Modulus
|
Warp
|
A
|
GPa
|
23
|
23
|
23
|
23
|
|
Fill
|
A
|
GPa
|
22
|
22
|
22
|
22
|
|
|
Tensile Strength
|
Warp
|
A
|
MPa
|
290
|
290
|
290
|
290
|
|
Fill
|
A
|
MPa
|
280
|
280
|
280
|
280
|
|
|
Young's Modulus
|
Warp
|
A
|
GPa
|
23
|
23
|
25
|
25
|
|
Fill
|
A
|
GPa
|
22
|
22
|
24
|
24
|
|
|
Glass Transition Temp.
|
DMA
|
A
|
℃
|
210
|
210
|
210
|
210
|
|
TMA
|
A
|
℃
|
180
|
180
|
180
|
180
|
|
|
Cofficent of Thermal Expansion
|
Warp, Fill
|
A
|
ppm/℃
|
15
|
15
|
15
|
15
|
|
Z(α1, α2)
|
A
|
ppm/℃
|
45/180
|
45/180
|
45/180
|
45/180
|
|
|
Peel Strength
|
12μ
|
A
|
KN/m
|
1.0
|
1.0
|
1.0
|
1.0
|
|
18μ
|
A
|
KN/m
|
1.2
|
1.2
|
1.1
|
1.1
|
|
|
Flame Resistance
|
UL94
|
E-168/70
|
—
|
HB
|
HB
|
HB
|
HB rating
|